1. 2. 3. material content data sheet sales product name ipi120n04s3-02 issued 29. august 2013 ma# MA000361816 package pg-to262-3-1 weight* 1578.59 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 12.237 0.78 0.78 7752 7752 leadframe non noble metal iron 7439-89-6 0.851 0.05 539 inorganic material phosphorus 7723-14-0 0.255 0.02 162 non noble metal copper 7440-50-8 849.682 53.82 53.89 538254 538956 wire non noble metal aluminium 7429-90-5 11.412 0.72 0.72 7229 7229 encapsulation organic material carbon black 1333-86-4 8.622 0.55 5462 plastics epoxy resin - 94.844 6.01 60081 inorganic material silicondioxide 60676-86-0 471.345 29.86 36.42 298587 364130 leadfinish non noble metal tin 7440-31-5 15.198 0.96 0.96 9627 9627 plating non noble metal nickel 7440-02-0 0.228 0.01 145 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 145 solder noble metal silver 7440-22-4 0.189 0.01 120 non noble metal tin 7440-31-5 0.151 0.01 96 non noble metal lead 7439-92-1 7.224 0.46 0.48 4576 4792 heatspreader inorganic material phosphorus 7723-14-0 0.032 0.00 20 non noble metal iron 7439-89-6 0.106 0.01 67 non noble metal copper 7440-50-8 106.210 6.73 6.74 67282 67369 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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